Quality
Reliability Laboratory
Full-dimensional testing, verification and professional analysis for continuous improvement of product reliability.
Laboratory Introduction
At MDD, our laboratories stand as the cornerstone of our unwavering commitment to quality and reliability. Equipped with state-of-the-art testing instruments and automated systems, our labs enable comprehensive reliability verification, electrical performance testing, and failure analysis across a diverse portfolio of product categories.

Backed by a professional team of R&D and testing experts, we rigorously adhere to international standards including IEC, JEDEC, and AEC-Q101, ensuring every product meets or exceeds global quality benchmarks. From high and low temperature characterization to surge testing, electrostatic discharge (ESD) evaluation, and end-of-life reliability assessment, every procedure is executed with precision and full traceability.

Our continuous investment in laboratory innovation not only drives product optimization and design enhancement, but also strengthens customer confidence in long-term reliability and consistent performance stability.
1500+㎡
of professional laboratory space
100+
sets of international-standard testing equipment
30+
experienced R&D and testing engineers
100%
full-process quality traceability system
Reliability Assurance
Failure Analysis
Application Analysis
    Test Items Test Conditions Referenced Standards
    Preconditioning (PC)

    1.TC: -55℃ ~ +150℃, 5 cycles（Optional）2.Bake:125°C /24H

    3.Soak:MSL1 85℃/85%RH； MSL3 30℃/60%RH 

    4.IR Reflow: Tc= 260 (+5/-0)°C

    JESD22-A113,

    J-STD-020

    High-Temperature Reverse Bias (HTRB)  Tj=Tjmax,100% rated Vr JESD22-A108, MIL-STD-750 M1038
    Intermittent Operating Life (IOL)

    Io@△Tj≥100℃ 

    SMD:on/off 2min

     JESD22-A122

     AEC-Q101

    Temperature Cycling (TC)

    Ta=-55+0℃/-10℃ 15min

    Ta=+150℃+15℃/-0℃ 15min

    Transfer time less than 1min

    		 JESD22-A108
    Pressure Cooker Test (PCT)  Ta=121℃/100%RH, +15psig JESD22A-102
    Resistance to Soldering Heat (RSH)

    Sn-Pb: 260(+5/-5)°C

    Pb-free: 270(+5/-5)°C

    JESD22-A111 SMD,

    B-106 PTH

    Solderability (SD)

    245 ℃ ± 5 ℃ (Pb-free)

    Solder cover is over 95%

    JESD22-B102

    J-STD-002

    Electrostatic Discharge (ESD) Characteristics

    HBM:C=100pf，R=1500Ω 

    MM :C=200pf， R=0Ω

    		 IEC61000 JESD22-A114 JESD22-A115
    Temperature and Humidity Test (THT)

    Ta: 85±2℃

    RH: 85±5%

    MIL-STD-750

    METHOD1021.2

    Forward Surge (FS/IFSM)  8.3 ms half sine-wave MIL-STD-750D METHOD 4066
    Test ItemsTest ConditionsReferenced Standards
    Preconditioning (PC)

    1.TC: -55℃ ~ +150℃, 5 cycles（Optional）2.Bake:125°C /24H

    3.Soak:MSL1 85℃/85%RH； MSL3 30℃/60%RH 

    4.IR Reflow: Tc= 260 (+5/-0)°C

    JESD22-A113,

    J-STD-020

    High-Temperature Reverse Bias (HTRB) Tj=Tjmax,100% rated VrJESD22-A108, MIL-STD-750 M1038
    Intermittent Operating Life (IOL)

    Io@△Tj≥100℃ 

    SMD:on/off 2min

     JESD22-A122

     AEC-Q101

    Temperature Cycling (TC)

    Ta=-55+0℃/-10℃ 15min

    Ta=+150℃+15℃/-0℃ 15min

    Transfer time less than 1min

    		JESD22-A108
    Pressure Cooker Test (PCT) Ta=121℃/100%RH, +15psigJESD22A-102
    Resistance to Soldering Heat (RSH)

    Sn-Pb: 260(+5/-5)°C

    Pb-free: 270(+5/-5)°C

    JESD22-A111 SMD,

    B-106 PTH

    Solderability (SD)

    245 ℃ ± 5 ℃ (Pb-free)

    Solder cover is over 95%

    JESD22-B102

    J-STD-002

    Electrostatic Discharge (ESD) Characteristics

    HBM:C=100pf，R=1500Ω 

    MM :C=200pf， R=0Ω

    		IEC61000 JESD22-A114 JESD22-A115
    Temperature and Humidity Test (THT)

    Ta: 85±2℃

    RH: 85±5%

    MIL-STD-750

    METHOD1021.2

    Forward Surge (FS/IFSM) 8.3 ms half sine-waveMIL-STD-750D METHOD 4066


    Test ItemsTest ConditionsReferenced Standards
    Preconditioning (PC)

    1.TC: -55℃ ~ +150℃, 5 cycles（Optional）2.Bake:125°C /24H

    3.Soak:MSL1 85℃/85%RH； MSL3 30℃/60%RH 

    4.IR Reflow: Tc= 260 (+5/-0)°C

    JESD22-A113,

    J-STD-020

    High-Temperature Reverse Bias (HTRB) Tj=Tjmax,100% rated VrJESD22-A108, MIL-STD-750 M1038
    Intermittent Operating Life (IOL)

    Io@△Tj≥100℃ 

    SMD:on/off 2min

     JESD22-A122

     AEC-Q101

    Temperature Cycling (TC)

    Ta=-55+0℃/-10℃ 15min

    Ta=+150℃+15℃/-0℃ 15min

    Transfer time less than 1min

    		JESD22-A108
    Pressure Cooker Test (PCT) Ta=121℃/100%RH, +15psigJESD22A-102
    Resistance to Soldering Heat (RSH)

    Sn-Pb: 260(+5/-5)°C

    Pb-free: 270(+5/-5)°C

    JESD22-A111 SMD,

    B-106 PTH

    Solderability (SD)

    245 ℃ ± 5 ℃ (Pb-free)

    Solder cover is over 95%

    JESD22-B102

    J-STD-002

    Electrostatic Discharge (ESD) Characteristics

    HBM:C=100pf，R=1500Ω 

    MM :C=200pf， R=0Ω

    		IEC61000 JESD22-A114 JESD22-A115
    Temperature and Humidity Test (THT)

    Ta: 85±2℃

    RH: 85±5%

    MIL-STD-750

    METHOD1021.2

    Forward Surge (FS/IFSM) 8.3 ms half sine-waveMIL-STD-750D METHOD 4066
pinpaimdd@mddchenda.com
+86 189 2606 7185